Parameter Table of Two-Component Epoxy Resin
| Model |
Features |
Proportion 25℃ |
Ratio |
Operating time/25℃ |
Hardness Shore D |
Tensile strength MPa≥ |
Temperature |
| 3601B |
Low viscosity
|
1.10±0.05 |
2:1 |
30 |
70±5 |
10 |
-40～80 |
| 3602B/W |
General purpose
|
1.80±0.05 |
5:1 |
40 |
80±5 |
15 |
-40～80 |
| 3603B |
Heat-resistant
|
1.80±0.05 |
10:1 |
40 |
80±5 |
15 |
-40～120 |
| 3605B/W |
Heat conduct
|
1.70±0.05 |
5:1 |
40 |
80±5 |
15 |
-40～90 |
| 3608T |
Transparent
|
1.05±0.05 |
2:1 |
40 |
80±5 |
10 |
-40～80 |
| 3612B\W |
Flame Retardant |
1.70±0.05 |
5:1 |
50 |
80±5 |
15 |
-40～90 |
|
Directions for use:
|
1, Clean the components and containers to be potted, ensure no dust, oil, and other contaminants on the surfaces.
2,Accurately weigh component A and B according to the ratio of product, stir the mixture well; (Some settlement maybe arise in component containing filler during storage, stir in original
container, and then preparation adhesive or potting).
3,After mixing, apply the mixture as soon as possible in its working life. Since the life time due to environmental temperature changes, please properly control the quantity of mixture prepared.
If viscosity of the mixture increases obviously, do not use it.
4,To ensure a void-free embedment,vacuum deairing is recommended. A residual pressure of 1-5mm mercury applied of 5- 10 minutes will be sufficiently, and then pour the mixture into electronic modules, continue to vacuumize 5-10 minutes to achieve better results if necessary.
5.If crystallization or agglomeration of component occurs at low temperature, place the component in 70-80℃ oven, melt the agglomeration, then cool the component to room temperature to use. It does not affect performance. During heating, the container should be opened to avoid damage by gas expansion. |
| Note: |
When temperature below 5℃, the mixture may not cure, heating curing is recommended."
|
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