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Epoxy adhesives&pottings
Two-Component Epoxy Resin Click to view product details >>
Model Features Typical uses
3601B

Low viscosity\potting\adhesive

Potting to protect for complex or small electronics module.

3602B/W

General purpose\potting

Potting to protect for common electronics module and PCB.

3603B

General purpose\potting\high temperature resistanc

Potting to protect for electronics with  requirement on temperature resistance.

3605B/W

Heat conductive\potting

Potting to protect for electronics with requirement on heat conductive performance.

3608

Transparent\ potting

Potting to protect for electronics module with requirement on transparent performance.

Note: T-Transparent,B-Black,W-White
Packing:

3602/3605:  6kg/set,    3603: 11kg/barrel;  3601/3608:  3kg/set.

Shanghai Welbond Chemicals Co. Ltd.
沪ICP备15032565号-1