Parameter Table of Two-Component Silicone,Condensation Type
| Model |
Features |
Proportion 25℃ |
Mix Ratio
|
Operating time/25℃ |
Hardness Shore A |
Tensile strength MPa≥ |
Volume resistivity Ω•cm≥ |
Temperature |
| 2301 |
Low viscosity
|
1.00±0.05 |
10:1 |
60 |
10±5 |
0.8 |
5.0×1014 |
-40～200 |
| 2302B/W |
General purpose
|
1.15±0.05 |
10:1 |
40 |
30±5 |
1.0 |
5.0×1014 |
-40～200 |
| 2302T |
Transparent
|
1.00±0.05 |
10:1 |
60 |
10±5 |
0.8 |
5.0×1014 |
-40～200 |
| 2302M |
Matted
|
1.10±0.05 |
10:1 |
40 |
25±5 |
1.0 |
5.0×1014 |
-40～200 |
| 2339B/W |
General purpose
|
1.15±0.05 |
10:1 |
40 |
20±5 |
1.0 |
5.0×1014 |
-40～200 |
| 2798 |
specially for modes
|
1.10±0.05 |
100:5 |
40 |
20±5 |
0.8 |
5.0×1014 |
-40～200 |
|
Directions for use :
|
1, Surface cleaning: clean the surface to be embedded, remove rust, dust, oil and so on,keep clean and dry.
2,Adhesive preparation and embedment: mixing componen (usually part A ) in the original packaging before weighing, then according to the ratio and the actual quantity needed,
weigh out the corresponding A, B component, stir well in a clean container.To ensure a void-free embedment,vacuum deairing is recommended. A residual pressure of 1-5mm mercury applied of 5-10 minutes will be sufficiently. When potting, carefully pour the mixture along a certain position of component to be sealed. Vacuum potting is recommended for high-voltage electrics and complex geometries .
3, Curing: the potted components shall be cured at room temperature.
4, Operating time and cure time are shortened as the amount of part B increased.and shorted as the amount of part B increased.
5. Filler settlement is common during storage, it can be used normally after mix well. Part B（curing agent） is color less or with a little ghtyellow. But along with time extension, the color maybe slowly deepens or with some settlement, it doesn't affect use. |
| Note: |
After potting, please not close or seal the mold before the mixture completely curing.
Please do not use when water or Solvent dropping in .
|
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